華碩高通 Snapdragon 855 旗艦機 ZenFone 6 西班牙發表,搭載 Flip Camera 翻轉相機與抓寶神機相同 5,000mAh 大電量、定價 499 歐元起

2019.05.17 02:59AM
41115
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華碩甫在片刻前,選於西班牙瓦倫西亞發表新一代旗艦機 ZenFone 6 ,外觀的設計誠如先前貿協所公布的一樣,採用 Flip Camera 翻轉相機機構作為塑造正面高螢幕占比的全螢幕設計方式,而另一個亮點就是採用與抓寶神器 ZenFone Max 家族同級的 5,000mAh 大電池,電池容量在各家旗艦機種中也是相當罕見的,並且具備頂級的高通 Snapdragon 855 平台、最大 8GB RAM 搭配最大 256GB ,鎖定發燒玩家在性能、拍照與續航力的全面需求。

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ZenFone 6 提供午夜黑與暮光銀兩色, 6GB RAM 64GB 版本要價 499 歐元, 6GB RAM 搭配 128GB 版本要價 559 歐元,頂規的 8GB RAM 256GB 版本為 599 歐元,預計在 5 月 25 日於歐洲上市,全球也將陸續推出。

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ZenFone 6 搭載 6.4 吋的 19.5:9 的 FullHD+ 螢幕,不過並未採用螢幕下指紋辨識,仍是傳統的機身後方電容辨識指紋辨識器,機身後方採用 3D 康寧玻璃,同時也採用 USB Type-C 介面與保留 3.5mm 耳機孔。核心採用高通 Snapdragon 855 ,除了當前 Android 最高效能平台特性,華碩亦活用其第四代 AIE 平台的 AI 技術與性能於相機技術,提供先進的 AI 影像技術輔助。

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ZenFone 6 使用大容量電池的原因,仍是滿足消費者需求,因為現在的高階手機使用者的使用黏著度高,但多數旗艦機種為了輕薄化多半使用 3,000mAh 到 4,000mAh 電池,藉由支援高速充電技術使其可在短時間充得電力,而 ZenFone 6 則索性搭載 5,000mAh 超大電池,並支援高通 QC4 高速充電技術,兼具續航力與快速充電。

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ZenFone 6 除了大電力外,另一個殺手鐧是採用 180 度翻轉的 Flip Camera 翻轉相機設計,在正式介紹翻轉螢幕前還鋪了相當長的埂,就為了強調正面沒有相機、螢幕也沒有凹槽或是開孔。最後透過機身上的 Google Assistant 快捷鍵,以語音指令呼叫 ZenFone 6 自拍,從講者手中的 ZenFone 6 以相當快的速度翻轉出相機模組。

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ZenFone 6 藉由航太級液態鋁合金構成翻轉相機模組,也是經常用於高階眼鏡的材料,相機模組搭載 Sony IMX586 48MP 像素 4 合 1 f1.79 大光圈主相機搭配 13MP 超廣角相機,並具備雷射對焦與 2x1 OCL 相位對焦技術, 48MP 主相機可藉像素合併為 12MP 取得良好的夜拍表現。

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利用步進馬達與翻轉機構組使模組進行翻轉,強調翻轉模組僅需 0.5 秒即可前翻,可藉由翻轉兼顧拍照與自拍影像與錄影品質,另外就連自拍也可獲得先進的 HDR+ 、 4K 60P 與 EIS 的高畫質錄影、高速慢動作與加持,同時可自動翻轉的相機模組更可自動旋轉拍攝構成超廣角與全景照片,甚至可操作鏡頭的翻轉角度進行創意角度拍攝。

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耐久度部分,除了相機模組使用高強度、高韌性的航太鋁合金材料,透過手機的加速度計、陀螺儀等,具備自主防護機制,經過內部測試,每天翻轉 28 次至少可確保 5 年內驅動機構仍可保持正常,華碩也播放一段放手給小孩使用各種方式、包括手指硬掰、用螺絲起子撬開、在機構中間放置物體等暴力操作,相機模組仍可維持翻轉與自由角度操作。

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此外, ZenFone 6 的 UI 也率先搭載 Dark Mode 、勿擾模式等,華碩還允諾 ZenFone 6 可持續獲得 Android Q 到至少 Android R 的系統更新。

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