將 AI 結合像機與日常體驗,華碩第五世代 ZenFone 5 動手玩

2018.04.12 02:59PM
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轉眼間,華碩的 ZenFone 系列也演進到第五世代,在主打平價雙相機的 ZenFone 5Q 在台登場後,緊接著就是基準款 ZenFone 5 登場,作為被華碩視為主力的 ZenFone 5 也相較 ZenFone 5Q 有著更好的規格與特色,同時也有著近期蔚為風潮的 18:9 異形屏設計。

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ZenFone 5 的設計元素仍承襲自 ZenFone 4 的前後 2.5D 雙玻璃設計,機背有著可視為華碩 Zen 系列最大特色的金屬髮絲紋 Zen 同心圓設計,強調中框以航太鋁材製成,搭配鈷石噴砂與八層光學塗層的表面處理,正面設計則使用具瀏海的異形屏設計,也擁有極高的螢幕佔比。

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為了提供合宜的使用體驗, ZenFone 搭載高通新世代的 Snapdragon 636 平台,搭配 4GB 的 RAM 與 64GB 內建儲存,雖乍看下 Snapdragon 636 的型號似乎遜於 Snapdragon 650 或是 660 系列,但本質上 Snapdragon 636 的性能與架構卻可說是 Snapdragon 660 的後續產品,同樣採用高通客製化核心搭配 Adreno506 GPU ,與 Snapdragon 630 的 ARM 標準微架構相去勝遠。

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也因此,搭載 Snapdragon 636 的 ZenFone 5 整體性能也直逼 Snapdragon 660 ,但更重要的是 Snapdragon 636 也具備 Snapdragon AI 引擎技術,活用平台中異構運算特性提供 AI 使用體驗,華碩亦強調活用 AI 技術作為提升使用體驗的手段,且不光只是用於相機與影像辨識,同時也融入使用體驗,甚至在性能評測亦可達到最高 12% 的提升。

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ZenFone 5 的 AI 功能可藉由持續累積資料,以約 2-3 周的使用行為分析使用者習慣,並用在如 Zen UI 5.0 app 列表中下方的常用 app 預測;設定 2-3 周使用行為是考慮到手機運算性能有限,若學習資料時間太長會消耗太多 AI 訓練基準,當前 AI 培訓的模型無法轉移,故重設與手機轉移都無法將先前的模型繼承過去。

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另外在電力管理的 BoostMaster 內,亦可藉由 AI 分析使用行為並進行充電的電力管理。其原理與 Sony 的 Qnovo 類似,是分析使用者充電與外出習慣,將電力先充至 90% 後,在使用者預計外出前再將電量充滿,對於作息較不規律的使用者,則可手動設定充電排程;透過 AI 方式避免電池因經常維持滿充而快速耗損,據稱相較一般充電可延長兩倍電池壽命。

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不過相較於 Sony 的 Qnovo ,筆者認為華碩應該要將充電機能寫入設定清單而非獨立 app 管理,其次排程應該要可直接與鬧鐘設定結合,如此一來對消費者的使用也更為方便。這部分也不僅出現在電力管理,如針對自拍的 Selfie Master 功能未直接整合到相機功能,而是為獨立 app 的型態,也是筆者較為不解的。至於電池容量為 3,300mAh ,支援 18W 快充,不過隨附變壓器為 10W ,須另行選購快充。

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ZenFone 5 的前方異形屏為 6.2 吋 19:9 比例 2,240 x 1,080 解析度螢幕,比起常規 18:9 更長的比例是因為分配給異形屏的頂部,頂部除了具安裝前相機、感測器的劉海外,也將四個邊角修飾成圓弧型。而在瀏海處也塞進包括趨近、光源、 RGB 感測器,電源燈、話筒與前相機,不過就沒有如 ZenFone 5Q 那樣還有前補光燈設計。

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相機功能也是這次 ZenFone 5 的強打項目,華碩也從軟體到硬體方面都下了一番功夫,務求在 ZenFone 5 的價格區間能有水準之上的演出;作為核心的硬體部分, 12MP 主相機搭載 1.4um 大畫素的 Sony 新一代的 IMX363 感光元件,並具備 0.03 秒雙相位對焦與 4 軸 OIS 、 f1.8 大光圈、 RGB 感測器等特色, 120 度 8MP 超廣角鏡頭雖未搭載頂級,夜拍表現大概是買乖乖送玩具等級,但仍可作為創意攝影之用。

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而在此次的自動拍攝功能方面, ZenFone 5 除了在自動模式加入 AI 物體辨識技術,並在偵測後套用合適的後製處理,也強調會在自動模式分析使用者拍攝與留下的照片類型,作為未來照片處理的基準,不過這部分需要時間累積,短時間較難看出結果;而在專業模式,則提供完整的手動設定供使用者自訂,亦可拍攝 12bit RAW 格式。這次補上的照片是同事 Elisa 代為拍攝,品質就如上面嚕。

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在此次的 Selfie Master 內,搭載稱為 ZeniMoji 的 Emoji 功能,藉由前相機搭配臉部偵測,可搭配可愛的虛擬形象,包括華碩的吉祥物 Zeni ,不過據稱原本談妥的合作趕不上上市開賣,目前僅有三種虛擬形象。 

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其它功能部份,包括搭載了雙揚聲器的 SonicMaster 5.0 聲籟技術,搭配 NXP 的智慧擴大機技術等,可提供豐沛的內建揚聲器播放音量與品質;同時除保留內建耳機孔以及符合 HiRes 認證外,還具備通過 HiRes 認證與通過 dts Headphone X 7.1 聲道認證的 ZenEar S 耳機。另外包裝中也提供清水套,提供基本的保護能力。

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